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TLC073IDR

Manufacturer Part Number:
TLC073IDR
Manufacturer / Brand
N/A
Part of Description:
IC CMOS 2 CIRCUIT 14SOIC
Datasheets:
TLC073IDR.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number TLC073IDR
Manufacturer / Brand N/A
Category Integrated Circuits (ICs) > Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Description IC CMOS 2 CIRCUIT 14SOIC
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply Span (Min) 4.5 V
Voltage - Supply Span (Max) 16 V
Voltage - Input Offset 390 µV
Supplier Device Package 14-SOIC
Slew Rate 19V/µs
Series -
Package / Case 14-SOIC (0.154", 3.90mm Width)
Package Tape & Reel (TR)
Output Type -
Operating Temperature -40°C ~ 125°C (TA)
Number of Circuits 2
Mounting Type Surface Mount
Gain Bandwidth Product 10 MHz
Current - Supply 2.1mA (x2 Channels)
Current - Output / Channel 57 mA
Current - Input Bias 1.5 pA
Base Product Number TLC073
Amplifier Type CMOS

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



TLC073IDR Product Details:

TLC073IDR: A Comprehensive Guide to Integrated Circuits As technology advances at unprecedented speed, electronic devices are becoming more complex, sophisticated, and intelligent. Integrated circuits (ICs) are at the heart of such devices, serving as critical components that enable efficient and reliable performance. TLC073IDR is a high-quality IC that has been meticulously designed and manufactured to meet the unique requirements of modern electronic devices. In this article, we will explore the main features, application scenarios, and manufacturing process of TLC073IDR to provide readers with valuable insights into this fascinating technology. TLC073IDR: Main Features and Performance Parameters TLC073IDR is a linear amplifier instrumentation OP amp that belongs to the IC CMOS 2 circuit 14SOIC classification. It is known for its exceptional performance parameters that include output voltage, current, power, accuracy, efficiency, and temperature range. Its main features are high input impedance, low offset voltage, low noise, and low power consumption. With such excellent parameters, TLC073IDR guarantees unrivaled performance, durability, and dependability. It is, therefore, a must-have for electronic devices that require high-precision and high-speed analog signal processing. TLC073IDR: Application Scenarios and Usage TLC073IDR has a versatile range of application scenarios and usages. It can be used in various electronic devices, including audio and video processing systems, medical equipment, automotive systems, power supplies, and communication systems. Its high-precision and low-noise performance characteristics make it ideal for applications that require sensitive analog signal processing, such as data acquisition, medical imaging, and industrial control. Types of Integrated Circuits: Digital, Analog, Mixed Signal, and RF TLC073IDR is a linear amplifier instrumentation OP amp that falls under the analog integrated circuits category. There are different types of integrated circuits such as digital, analog, mixed-signal, and radiofrequency (RF) ICs. Digital ICs are employed in logic gates, microprocessors, and memory circuits, while analog ICs are widely used in audio and video processing systems, power management, and sensors. Mixed-signal ICs combine both digital and analog components and are used in mobile devices, smart homes, and IoT applications. RF ICs are used in radiofrequency communications, such as wireless phones, satellite communications, and radar systems. Manufacturing Process of Integrated Circuits The manufacturing process of ICs is complex and involves several stages, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The chip design stage involves designing the circuits on a silicon wafer using computer-aided design tools. Cutting and cleaning involve separating the chips and removing any impurities, respectively. Laser processing is used to create the circuits, while back grinding reduces the thickness of the chip. Doping adds impurities to create the required electrical properties, while exposure and vapor deposition transfer patterns onto the chip surface. Etching removes unwanted material, and packaging is applied to protect the finished chip. Packaging and Testing Once the integrated circuits are manufactured, appropriate packaging and testing are required to ensure component quality. IC packaging involves encapsulating the bare die and connecting it to external leads, including solder balls, pins, or pads. IC testing is performed to verify the components' electrical performance, functionality, and reliability. Various methods are used for IC testing, including wafer-level testing, where the wafers are tested before cutting into individual chips, and final testing, where the packaged chips are tested. Conclusion In conclusion, integrated circuits such as TLC073IDR are essential components that form the backbone of modern electronic devices. They are designed and manufactured to meet different application requirements, with exceptional performance parameters, complex manufacturing processes, and stringent quality testing. To truly appreciate integrated circuits, it is essential to understand their application scenarios, main features, types, and manufacturing processes. With this knowledge, we can harness the power of integrated circuits to develop innovative and groundbreaking electronic devices that enrich our daily lives.

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